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DUBLIN , July 8, 2022 /PRNewswire/ -- The "Bonding Sheet Market by Adhesive Material (Polyesters, Polyimides, Acrylics, Modified Epoxies), Application and Region - Global Forecast to 2027" report has been added to ResearchAndMarkets.com's offering.
The global bonding sheet market size is projected to grow from USD 386 million in 2022 to USD 551 million by 2027, at a CAGR of 7.4% between 2022 and 2027.
Increasing demand for electric vehicles, government incentive and schemes, and miniaturization of electronic components are key factors for the growth of the bonding sheet market. Additionally, the development of the telecommunication industry is expected to offer significant growth opportunities to the bonding sheet manufacturers. However, high capital investment and geopolitical uncertainties is expected to restrict the growth of the market. The major challenge faced by players is stringent environmental regulation and impact of moisture on bonding sheets. In terms of value, the polyimide adhesive material segment is projected to account for the largest share of the bonding sheet market, by adhesive material, during the forecast period. Polyimide bonding sheet possesses high tensile strength and dimensional stability with chemical and heat resistant properties. Polyimide bonding sheets have applications in electronics/optoelectronics, telecommunication, automotive, and other end-use industries for flexible printed circuits, multi-layer FPCs, and bonding of materials such as camera modules & lens mounting, RF modules, and stiffeners. 25m (1mil) adhesive thickness segment accounted for the largest market share in the bonding sheet market Adhesive thickness ensures the bonding strength of adhesive and coverage over a bonding surface. Demanding electronics applications such as adhesion of flexible circuits to rigid boards, rigid-flex circuits, multi-layer FPCs utilize this type of bonding sheet for the development of electronics products. Moreover, it allows multiple lamination cycles and provides superior bonding strength for electronics materials. The electronics/optoelectronics application segment is estimated to account for the largest share in the bonding sheet market The development of consumer electronics devices with the integration of artificial intelligence (AI), internet of things (IoT), and emerging trends of smart devices is increasing the demand for bonding sheets for electronics/optoelectronics applications. Additionally, the development of emerging telecommunication technologies are also significant driver for the growth of the bonding sheet market. Bonding sheets are used as interlayer insulating materials for FPCs, LEDs, heat dissipation, and other electronic/optoelectronic applications. Asia Pacific region leads the bonding sheet market in terms of value. Asia Pacific countries such as Japan , China , and India are major markets of bonding sheets in the region. The growing electronics industry coupled with supportive government initiatives such as subsidies, incentives schemes, and tax benefits for electronics manufacturers will support the growth of the bonding sheet market. Moreover, the availability of raw materials, affordable labor cost, and established regional manufacturers is expected to propel the growth of the market during the forecast period.
Key Topics Covered: 1 Introduction 2 Research Methodology 3 Executive Summary 4 Premium Insights 4.1 Emerging Economies to Witness High Growth in Bonding Sheet Market 4.2 Bonding Sheet Market, by Adhesive Material 4.3 Bonding Sheet Market, by Adhesive Thickness 4.4 Bonding Sheet Market, by Application 4.5 Bonding Sheet Market, by Country
5 Market Overview 5.1 Introduction 5.2 Market Dynamics 5.2.1 Drivers 5.2.1.1 Miniaturization of Electronic and Semiconductor Components 5.2.1.2 Rising Demand for Electric Vehicles 5.2.2 Restraints 5.2.2.1 Geopolitical Uncertainties Hamper Free Flow of Goods in Semiconductor Industry 5.2.2.2 Volatility in Prices of Raw Materials 5.2.3 Opportunities 5.2.3.1 Lightweighting Transportation Equipment 5.2.3.2 Developments in Telecommunications Industry 5.2.4 Challenges 5.2.4.1 Paper/Tissue-Backed Bonding Sheet Prone to be Affected by Moisture 5.2.4.2 Stringent Environmental Regulations 5.3 Porter's Five Forces Analysis 5.3.1 Threat of New Entrants 5.3.2 Threat of Substitutes 5.3.3 Bargaining Power of Suppliers 5.3.4 Bargaining Power of Buyers 5.3.5 Intensity of Competitive Rivalry 5.4 Value Chain Analysis 5.5 Ecosystem Mapping 5.6 Trade Analysis 5.7 Pricing Analysis 5.8 Impact of COVID-19 on Bonding Sheet Market 5.8.1 Impact of COVID-19 on the Electronics Industry 5.8.2 Impact of COVID-19 on the Automotive Industry 5.9 Trends/Disruptions Impacting Customers' Businesses 5.10 Patent Analysis 5.11 Technology Analysis 5.11.1 5G Telecommunications and Bonding Sheets 5.11.2 Electric Vehicles and Bonding Sheets 5.12 Marketing Channels 5.13 Key Conferences & Events in 2022-2023 5.14 Tariff and Regulatory Landscape 5.14.1 Regulatory Bodies, Government Agencies, and Other Organizations 5.15 Operational Data 5.15.1 Trends in the Electronics Industry 5.15.2 Trends in Automotive Industry 5.16 Key Factors Affecting Buying Decisions 5.16.1 Quality 5.16.2 Service 5.17 Macroeconomic Analysis
6 Bonding Sheet Market, by Adhesive Material 6.1 Introduction 6.2 Polyesters 6.2.1 Polyester Bonding Sheet is Apt for Insulation Applications Requiring Thin and Durable Materials with High Dielectric Strength 6.3 Polyimides 6.3.1 Preference for Polyimide Bonding Sheet for Flexible Display and Optoelectronics to Boost Market 6.4 Acrylics 6.4.1 Increasing Use of Acrylic Bonding Sheets in Automotive Applications Expected to Fuel Demand 6.5 Modified Epoxies 6.5.1 These Adhesives are Widely Used for Bonding Electronic Components 6.6 Others
7 Bonding Sheet Market, by Adhesive Thickness 7.1 Introduction 7.2 12m 7.3 25m 7.4 50m 7.5 75m 7.6 100m
8 Bonding Sheet Market, by Application 8.1 Introduction 8.2 Electronics/Optoelectronics 8.2.1 Home Appliances 8.2.2 Led Substrates 8.2.3 Industrial Equipment 8.2.4 Others 8.3 Telecommunication/5G Communication 8.4 Automotive 8.5 Building & Construction 8.6 Others
9 Bonding Sheet Market, by Region
10 Competitive Landscape 10.1 Introduction 10.2 Market Evaluation Matrix 10.3 Revenue Analysis of Top Players 10.4 Market Ranking Analysis 10.4.1 Arisawa Manufacturing Co., Ltd. 10.4.2 Nitto Denko Corporation 10.4.3 Dupont 10.4.4 Dexerials Corporation 10.4.5 Nikkan Industries Co., Ltd. 10.5 Company Evaluation Matrix 10.5.1 Star 10.5.2 Emerging Leaders 10.5.3 Pervasive 10.5.4 Participant 10.6 Competitive Benchmarking 10.7 Company Evaluation Matrix (Startups/Smes) 10.7.1 Progressive Companies 10.7.2 Responsive Companies 10.7.3 Starting Blocks 10.7.4 Dynamic Company 10.8 Competitive Benchmarking (Startups/Smes) 10.9 Competitive Scenario 10.9.1 New Product Launches 10.9.2 Deals 10.9.3 Other Developments
11 Company Profiles 11.1 Key Players 11.1.1 Arisawa Manufacturing Co., Ltd. 11.1.2 Nitto Denko Corporation 11.1.3 Dupont 11.1.4 Dexerials Corporation 11.1.5 Nikkan Industries Co., Ltd. 11.1.6 Showa Denko Materials Co., Ltd. 11.1.7 Toray Industries, Inc. 11.1.8 Namics Corporation 11.1.9 Shin-Etsu Polymer Co., Ltd. 11.2 Other Players 11.2.1 Taiflex Scientific Co., Ltd. 11.2.2 Shengyi Technology Co., Ltd. 11.2.3 Innox Advanced Materials Co., Ltd. 11.2.4 Iteq Corporation 11.2.5 Microcosm Technology Co., Ltd. 11.2.6 Shandong Golding Electronics Materials Co., Ltd 11.2.7 Hanwha Solutions Advanced Materials Division 11.2.8 Nippon Mektron, Ltd. 11.2.9 Risho Kogyo Co., Ltd. 11.2.10 Dongyi 11.2.11 Teraoka Seisakusho Co., Ltd. 11.2.12 Fujikura Ltd. 11.2.13 Qinglong Adhesives 11.2.14 Panasonic Industry Co., Ltd. 11.2.15 Lintec Corporation
For more information about this report visit https://www.researchandmarkets.com/r/z2powo
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